Last week, we told you that Huawei was planning to unveil its next flagship, the Huawei Ascend P8 on April 15th. This will be after this year’s edition of Mobile World Congress that is set for March. April 15 may be far from now but we are getting some information about the specifications and features the Ascend P8 will be packing.
As per the current information, the Huawei Ascend P8 will be having the company’s latest Kirin 930 chipset. This is the first chipset that has been made using 16nm process technology.
The Ascend P8 will have a 5.2-inch Full HD screen that is a slight improvement from the Ascend P7 that has a 5.0-inch screen. Like the Honor 6 Plus, the Huawei Ascend P8 will have dual cameras (probably 13MP ones) that will be very interesting if it turns out true. Powering this device will be a 2600mAH battery which is slightly bigger than the 2500mAH battery on the Ascend P7.
The Huawei Ascend P8 is believed to have a ceramic uni-body design and will have a double sided gorilla glass 3 protection. It will be 6mm thick which is quite thin for its size, even thinner than the iPhone 6 that is about 6.9mm thick.
The price for the Ascend P8 is not cheap and will be around $480 (approximately Kshs. 44,000 before taxes). Will you be getting this Smartphone?